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• Liquid & Glue motor

  BGA Pasted Ic Remover Liquid

  

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  ₹500.00

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• Liquid & Glue motor

  YAXUN 535 Pasted IC Remover Liquid

  

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  ₹550.00

  Applicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.

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