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Liquid & Glue motor
YAXUN 535 Pasted IC Remover Liquid
₹550.00
Add to cartApplicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.
Repairing of OCA Machine, SMD, POWER SUPPLY, IRON
REPAIRING
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