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140,165.00

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Quantity 155.00
Quantity 200.00
Quantity 11,900.00
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Quantity 2,100.00
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Quantity 400.00
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YAXUN 535 Pasted IC Remover Liquid

550.00

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Applicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.

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44
140,165.00

Cart

Quantity 155.00
Quantity 200.00
Quantity 11,900.00
Quantity 250.00
Quantity 350.00
Quantity 480.00
Quantity 80.00
Quantity 2,100.00
Quantity 500.00
Quantity 7,200.00
Quantity 400.00
Quantity 250.00
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