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MIJING SG25 Soft Glue Heating Free Curing Glue
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MIJING SG25 30CC Bracket Elastic Soft Glue for Mobile Phone Back Cover/Frame/LCD Screen Repair Heating Heating Free Curing Glue
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Goot Soldering Paste 10g
₹150.00Add to cartA surface to be joined that is oily or oxidized will prevent solder from spreading during soldering. This soldering paste removes such oil or oxides and improves wettability. Assists soldering of electrical wiring and electrical components in hobby kits.
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RELIFE Halogen Free Flux Paste RL-559-IM original flux
₹650.00Original price was: ₹650.00.₹600.00Current price is: ₹600.00.Add to cartRELIFE Halogen Free Flux Paste RL-559-IM original flux Name: Halogen free Flux Paste(LEAD-FREE) Model: RL-559-IM Imported rosin from Japan, environmentally, lead-free and halogen-free, with high safety. Strong activity, good viscosity, good fluidity and easier tinning. Milky white paste, no residue, fast tinning. High insulation resistance, suitable for mobile phone motherboards, cpu repair, etc.
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Koocu Flux Paste Premium Quality
₹100.00Add to cartSolder paste / solder flux is available in the form of paste containing brownish resin filled in metal containers to retain its properties Flux strong bright spot, less residue. It cleans and prevents metal oxidation allowing the solder to form strong, mechanical and electrical bonds
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Bit Cleaner Rosin Paste
₹30.00Add to cartBit cleaner rosin paste is a solution to avoid oxidation issues while soldering. If the surface of the solder or element is oxidized, then it is not easy to stick to the tin and the following welds. The resin quickly removes oxidation, making the components easier to pass through the …
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2UUL Snk Solder PPD 50G
₹550.00Add to cart2UUL 50G SNK solder paste fluxing weld for iphone ic cpu reballing repair nand flash reball welding paste
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Relife RL-406S Paste
₹450.00Add to cartRELIFERL-406S HIGH TEMPERATURE LEAD-FREE TIN PASTE 1. 227°C high temperature lead-free tin paste suitable for IP12/12Pro/12Pro Max middle layer tin planting. 2.Silver, lead free, high purity.
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