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KOOCU 1502DS Dc Power Supply (15V ~ 2A)
₹1,550.00
TOP RATED PRODUCTS
Applicable to softening and removing the mobile phone BGA IC chips and main board resin sealants. This product use new Eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.
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Repairing of OCA Machine, SMD, POWER SUPPLY, IRON
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