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Features:
- Mijing Z20 Pro 18-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture for iPhone X/XR/Xs/Xs Max/11/11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max, convenient and faster for reballing BGA without any damage, offer you the best solution for BGA reballing and repairing
How to use:
- Install the main board on the platform
- Cover the BGA reballing stencil on the mainboard
- Evenly spread tin on the cover of the reballing stencil
- Remove the reballing stencil cover
- Take out the motherboard and cooperate with the hot air gun to solidify the tin point
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₹4,500.00Original price was: ₹4,500.00.₹4,200.00Current price is: ₹4,200.00.Add to cartMijing Z21 Max Universal CPU BGA Reballing Stencil Platform For Phone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
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Mijing C18
₹8,700.00Original price was: ₹8,700.00.₹8,200.00Current price is: ₹8,200.00.Add to cartMIJING C18 FOR IPHONE 11/11PRO/11PROMAX MAX MAIN BOARD FUNCTION TESTING FIXTURE Feature: Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speed Check in advance to avoid duplicate disassembling and breaking the motherboard Small size, easy to carry. Operational Process: 1, Prepare Power On/Off Cable*1 Power Line*1 LCD Test Cable*1 Screen*1 Main Board*1 2, Decomposition iPhone 11/11p/11pro Middle Layer simply equipped the test fixture. 3, Install: Put in the lower main board, put on the pin board, put the top board in, and then cover the test rack. 4, The first way to connect the screen line,boot,power cord or battery test ink success or not. The second way is to connect the end plug on the base of the first method to implement the brush functio
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